NMJ30203 Microelectronic Fabrication I Assignment Semester 1, 2025/2026 | UniMAP

Each section should connect current practices with emerging or future innovations in the semiconductor industry.

Suggested Paper Structure

1. Abstract (150–200 words)

Briefly summarize the purpose, scope, and main findings of your paper.

2.  Introduction

• Provide background on semiconductor fabrication.
• Explain why technological innovation is essential to sustain Moore’s Law.
• State the aim of your paper.

3.  Main Content (Organized by Chapter Topics)

Section 1: Fundamentals to Microelectronic Fabrication

• Evolution of integrated circuit manufacturing.
• Role of nanotechnology, EUV lithography, and AI automation.

Section 2: Cleanroom Technology

• Importance of contamination control.
• Smart cleanrooms, green HVAC systems, and robotic handling.

Section 3: Semiconductor Devices

• From MOSFET to FinFET and GAA nanosheet transistors.
• Future device architectures and neuromorphic/quantum systems.

Section 4: Wafer Manufacturing

• Evolution from 200 mm to 300 mm and upcoming 450 mm wafers.
• Advances in epitaxial growth, crystal perfection, and defect control.

Section 5: Semiconductor Materials

• From Si to SiC, GaN, and 2D materials (MoS₂, graphene).
• Material integration for heterogeneous and high-performance systems.

Section 6: Wafer Cleaning and Surface Preparation

• Importance of pre- and post-process cleaning.
• Advanced dry and supercritical cleaning for 3D and GAA devices.

Section 7: Malaysia’s Semiconductor Potential

• Strong semiconductor ecosystem and industrial clusters.
• Global OSAT leadership (13% of world market).
• Advanced packaging and chiplet opportunities.
• Workforce upskilling and engineering talent.
• Potential for front-end wafer fabrication and specialty materials.

4. Future Outlook

• Predict key breakthroughs in the next 10–20 years.
• Discuss sustainability, AI, and hybrid integration in fabs of the future.

5. Conclusion

Summarize findings and reflect on how the six areas are interrelated in building next-generation semiconductors.

6. References (APA or IEEE Style)

At least 10 reliable references from journals, conference papers, or credible industry sources (IEEE, Elsevier, SEMI, etc.).

Marking Scheme

Submission Guidelines

• Submit in PDF format through the e-learning platform.
• Font: Times New Roman, 12 pt, spacing: 5, justified alignment.
• Include cover page with Student Name, Matric No., and Programme Code.
• Plagiarism must not exceed 30% (checked via Turnitin).
• Submit via the designated e-learning platform.

Suggested Research Topics (Optional Inspiration)

• The Future of EUV and High-NA Lithography.
• Role of Artificial Intelligence in Wafer Defect Control.
• Sustainability and Green Manufacturing in Semiconductor Fabs.
• Integration of GaN, SiC, and 2D Materials in Future Electronics.
• Quantum and Neuromorphic Devices: The Post-CMOS Era.
• Malaysia’s opportunities in advanced packaging and wafer fabrication.

Expected Outcome

By completing this assignment, students should be able to:

• Demonstrate comprehensive understanding of semiconductor fabrication from wafer to device.
• Analyze current and future technologies in the global semiconductor industry.
• Identify emerging materials, processes, and device trends beyond conventional silicon.
• Discuss Malaysia’s semiconductor potential in OSAT, advanced packaging, and wafer fabrication
• Write a technical journal-style paper that reflects professional and industry-oriented insight.